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Power Solution
For low profile and compact components in power application, Inpaq provides total power inductor solutions for portable devices, smart phone, table PC/PAD, two process technologies of Wire-wound platic molding with magnetic powders (Metal molding series) and Multilayer ferrite/ceramic co-firing in high temperature process (Multilayer Ferrite series). WIP and MIP series are available and EIAJ Size: 2520/2016 for WIP, 2520/2016 for MIP series. inductance range from 0.24~4.7uH.
Power Inductor
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