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2025-09-26
WinTech 2025: Green Future

WinTech 2025: Green Future — Smart Technology × Sustainable Innovation

Co-hosted by Winbond Electronics and the Walsin Technology Group, the annual technology event “WinTech 2025 returns with a refreshed vision under the theme of “Green Future.” This year’s focus is on how innovative technologies can accelerate a sustainable future. WinTech will showcase how group members leverage their core competencies in MCUs, memory ICs, MLCCs, battery technologies, circuit protection components, and high-frequency antennas—along with mobile and automotive keypad modules—to deliver comprehensive solutions covering computing cores, data storage, power management, signal transmission, and human-machine interfaces. These offerings are widely applied in fields such as safety protection, automotive electronics, smart devices, industrial automation, and green energy, pushing forward a safer, more efficient, and more sustainable tomorrow.

The forum brings together key experts from Winbond Electronics, Walsin Technology, Nuvoton Technology, INPAQ Technology, Silitech Technology, and FDK Corporation, sharing deep insights on industrial applications, in-vehicle systems, AI edge computing, cybersecurity, and power management. Through technology showcases and trend discussions, the event aims to guide the industry toward a future that balances efficiency with sustainability.

Event Date: September 26, 2025 (Friday) 09:30AM–5:00PM (Check-in: 08:30AM–09:30AM)

Media Link: https://www.digitimes.com.tw/seminar/Winbond_20250926/

Organizers: Winbond Electronics and PSA Group

Venue: HNBK International Convention Center, No. 123, Songren Rd., Xinyi Dist., Taipei 110, Taiwan

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