Material Technology
| Cu | FOR | Conducting |
| Ti/W | Buffer layer | |
| Epoxy,Polyimide(all photo-resistor) | Insulation | |
| Silicon Nitride | Dielectric | |
| For Termination:Ni/Sn | Termination | |
| Ferrite,Alumia,Silicon,ALN | Substrate | |
| Ferrite,Dielectric,glass,Ag | Co-firing |
