Material Technology
Cu | FOR | Conducting |
Ti/W | Buffer layer | |
Epoxy,Polyimide(all photo-resistor) | Insulation | |
Silicon Nitride | Dielectric | |
For Termination:Ni/Sn | Termination | |
Ferrite,Alumia,Silicon,ALN | Substrate | |
Ferrite,Dielectric,glass,Ag | Co-firing |